
Staff Signal Integrity Engineer
Qualcomm · Posted Oct 22
Semiconductor, 5G wireless technology, mobile platform, and AI computing solutions
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About the role
The CHS Signal Integrity organization at Qualcomm is responsible for end-to-end SI/PI architecture, analysis, and signoff for next-generation mobile, compute, Automotive and various other connectivity platforms. As a Qualcomm ASIC Engineer, you would define, model, design, optimize, verify, validate, implement, and document IP development for high performance, high quality, low power products. This individual-contributor Staff role owns system-level SI/PI closure across SoC, package, board and connectors, defines company-wide SI/PI methodologies, drives high-speed interface co-design, and mentors senior engineers.
What you will do
- System SI/PI owner across full platform (SoC ↔ package ↔ board ↔ connectors ↔ external systems)
- Technical owner for high-speed interfaces and system margins
- Cross-functional leader driving SIPI driven design convergence across silicon, package, and platform teams
- Own end-to-end SI/PI closure for programs (pre-silicon → post-silicon → production)
- Define design targets and layout design guidelines for all high-speed interfaces
- Influence architecture decisions early in product lifecycle
- Ensure SI/PI alignment with product KPIs (performance, yield, power, cost)
- Drive new IP co-design across IC/IO/PHY, package, and PCB
- Ensure compliance to standards (JEDEC, PCI-SIG, MIPI, IEEE)
- Influence PDN architecture definition at system and package level, provide related optimum cost solutions
- Ensure cross functional alignments. Partner with SoC/PHY design teams, Package engineering, Board/system teams and OEM/ODM ecosystem
- Lead design reviews and signoff decisions
- Represent SI/PI in program reviews and leadership forums
- Define company-wide SI/PI methodologies
- Drive correlation between pre-silicon models and silicon/lab data
- Lead debug of eye collapse / jitter margin issues, crosstalk and power noise and silicon-package-board interactions
- Drive best practices adoption across programs
- Establish golden methods for system SI/PI
- Mentor senior engineers across SI/PI domains
Skills used in this role
What the employer is looking for
- Bachelor's degree in Science, Engineering, or related field and 4+ years of ASIC design, verification, validation, integration, or related work experience.
- Master's degree in Science, Engineering, or related field and 3+ years of ASIC design, verification, validation, integration, or related work experience.
- PhD in Science, Engineering, or related field and 2+ years of ASIC design, verification, validation, integration, or related work experience.
- 8+ years in Signal Integrity / Power Integrity / High-speed systems
- Proven ownership of multiple tapeouts or high-volume products
- Deep expertise in Transmission line theory, EM fundamentals, SI/PI interactions and jitter/noise coupling.
- Strong hands-on experience with: Tools: HFSS, ADS, Sigrity, CST, SIwave, HSPICE; Measurement: VNA, TDR, real-time scopes
Preferred qualifications
- Experience with: Packaging technologies like FCBGA, 2.5D/3D; Products like Data center, Compute and Servers
- Track record of Patents, standards contributions, or published work internal / external conferences
Benefits and support
- Compensation and benefits are detailed in the job posting
About Qualcomm
Qualcomm is a global leader in the development and commercialization of foundational technologies for the wireless industry, including mobile processors, 5G, and on-device artificial intelligence. The company designs and markets digital communications products, semiconductor solutions, and system software used globally across smartphones, automotive solutions, IoT devices, and computing systems. Through extensive R&D and intellectual property licensing, Qualcomm powers a highly interconnected and smarter world.
- Industry
- Semiconductors
- Company size
- 50000+ employees
- Founded
- 1985
- Location
- San Diego, California, USA
- Funding stage
- Public Company
Funding
Public Company · $53M raised
- 2018-11-01Grant
Leadership
President and Chief Executive Officer
Chief Financial Officer and Chief Operating Officer
James H. Thompson
Chief Technology Officer
Chief Marketing Officer
Ann Chaplin
General Counsel and Corporate Secretary
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