Staff Engineer, Physical Design
Micron · Posted Oct 5
DRAM, NAND, HBM memory and computer data storage solutions
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About the role
Micron Technology is an industry leader in memory and storage solutions, delivering high-performance DRAM, NAND, and NOR products that fuel the data economy, AI, and 5G applications. The physical design team works on the design, layout, and optimization of Memory/Logic/Analog circuits from top-level planning through tape-out. This role owns top-level design planning and integration, block-level APR and sign-off, and methodology/automation improvements using Tcl, SKILL, and Python.
What you will do
- Contributing to the development of new product opportunities by assisting with the overall design, layout, and optimization of Memory/Logic/Analog circuits
- Parasitic modeling and assisting in design validation, reticle experiments and required tape-out revisions
- Leading all aspects of and managing the layout process including floor-planning, placement, and routing
- Performing verification processes with modeling and simulation using industry standard simulators
- Contributing to cross group communication to work towards standardization and group success
- Working with Marketing, Probe, Assembly, Test, Process Integration, and Product Engineering groups to ensure accurate manufacturability of product
- Proactively solicit mentorship from Standards, CAD, modeling, and verification groups to improve the design quality
- Driving innovation into the future Memory generations within a dynamic work environment
- Perform top-level virtual flat placement to explore partitioning options and validate hierarchy quality before commit.
- Implement top-level global routing to derive congestion, timing, and pin-feasibility signals that drive planning decisions.
- Own partition creation: block shaping, abutment, channel/keep-out definition, and power-domain planning.
- Drive pin optimization / pin cutting — pin placement, alignment, and count reduction guided by top-level routing.
- Plan and implement repeater / feedthrough insertion: budget top-level nets, place repeaters, and manage crossings across partition boundaries.
- Generate block-level constraints (timing budgets, boundary SDC, ILM/ETM models, physical constraints) directly from the design planning tool and hand them off to block owners.
- Perform top-level assembly: integrate block-related work (LEF/DEF/GDS/ETM/ILM), close top-level timing, DRC, LVS, and EM/IR, and iterate ECOs to convergence.
- Implement full APR flow (init → floorplan → place → CTS → route → ECO → sign-off) on digital blocks; own block-level STA sign-off across corners alongside DRC, LVS, EM/IR, and antenna closure.
- Set up new project and revision environments — collateral (SDC, netlist, LEF, QTM), stdlib migrations, and constraint authoring.
- Debug and correlate synthesis vs. APR vs. STA (PPA regressions, DRV, size_only/don't_touch strategy, scan chain stitching).
- Automate flows in Tcl / SKILL / Python; extend internal make-based flow and contribute to shared analysis tooling and dashboards.
- Improve the processes efficiency and quality leveraging AI flows
- Partner with STA, DFT, CAD, and custom-layout teams; document methodology and provide mentorship to engineers gaining experience.
Skills used in this role
Benefits and support
- Compensation and benefits are detailed in the job posting
About Micron
Micron Technology, Inc. is a world leader in innovative memory and storage solutions, manufacturing DRAM, NAND, NOR, and High Bandwidth Memory (HBM) technologies. The company provides foundational computing capabilities for artificial intelligence, 5G, data centers, and consumer electronics worldwide. Headquartered in Boise, Idaho, Micron plays a critical role in powering next-generation computing architectures.
- Industry
- Semiconductors
- Company size
- 56,000 employees
- Founded
- October 5, 1978
- Location
- Boise, Idaho, USA
- Funding stage
- Public Company
Leadership
Chairman and Chief Executive Officer
Executive Vice President and Chief Financial Officer
President and Chief Operating Officer
President and Chief Technology and Products Officer
Executive Vice President and Chief People Officer
Senior Vice President, Chief Legal Officer and Corporate Secretary