
Sr Engineer, MDS Support
Micron · Posted Oct 28
DRAM, NAND, HBM memory and computer data storage solutions
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About the role
Micron Technology is an industry leader in innovative memory and storage solutions, delivering DRAM, NAND, and NOR products that fuel the data economy. The MDS support team handles PCB build data, BOM variants, and engineering documentation within Micron's PLM and design-release processes. This role builds and reviews PCB BOM variants and manufacturing array drawings in Cadence and Teamcenter, collaborating with hardware, DFM, and manufacturing teams to resolve build and design-release issues.
What you will do
- Build and maintain the PCB BOM variants using Cadence Variant tools and Teamcenter, technically adhering to established Micron processes and engineering requirements for various Micron products.
- Review and confirm BOM variants for component details, part status, substitutions, DNI/MP requirements, mechanical content, and data accuracy.
- Perform Teamcenter/PLM activities, including project and variant data management and support for build release activities.
- Build, maintain, and review PCB manufacturing array drawings and templates based on defined Manufacturing/DFM requirements, including dimensions, board orientation, panelization, tooling features, and fiducial.
- Conduct build-data and documentation checks to ensure compliance with Micron PCB build and manufacturing requirements.
- Maintain engineering documentation, checklists, and build records essential to supporting MDS activities and design releases.
- Collaborate with PCB Build, Hardware Engineering, Manufacturing/DFM, and various multi-functional teams to resolve BOM, variant, array, and design-release related issues.
- Support continuous improvement and automation initiatives, leveraging AI, adopting intelligent solutions to improve the quality, consistency, and efficiency of MDS processes and your work.
Skills used in this role
What the employer is looking for
- Bachelor’s degree or equivalent experience in Electronics/Electrical Engineering or a related engineering field.
- 10+ years of filed experience in PCB build support, BOM management, PLM, PCB library, manufacturing documentation, or related engineering activities.
- Hands-on experience with PLM tools such as Teamcenter or Windchill.
- Working knowledge of Cadence Allegro/HDL and Cadence Variant Editor.
- Solid knowledge of PCB BOM and variant management.
- Experience in crafting or reviewing PCB array/panel drawings and manufacturing documentation.
- Familiarity with AutoCAD, CAM350, and Valor NPI is preferred.
- Good understanding of PCB build, fabrication, assembly, component libraries, and engineering release processes.
- Strong analytical, problem-solving, organizational, and computer skills.
- High attention to detail with a flawless focus on building and maintaining accurate and detailed data.
- Excellent verbal and written communication skills and the ability to collaborate effectively across global engineering teams.
- Ability and willingness to learn new EDA/PLM tools, automation technologies, and evolving Micron processes.
- Proficiency in AI and automation tools, or a willingness to learn, adopt, and apply these technologies to improve processes and deliverables, is also expected.
Benefits and support
- Compensation and benefits are detailed in the job posting
About Micron
Micron Technology, Inc. is a world leader in innovative memory and storage solutions, manufacturing DRAM, NAND, NOR, and High Bandwidth Memory (HBM) technologies. The company provides foundational computing capabilities for artificial intelligence, 5G, data centers, and consumer electronics worldwide. Headquartered in Boise, Idaho, Micron plays a critical role in powering next-generation computing architectures.
- Industry
- Semiconductors
- Company size
- 56,000 employees
- Founded
- October 5, 1978
- Location
- Boise, Idaho, USA
- Funding stage
- Public Company
Leadership
Chairman and Chief Executive Officer
Executive Vice President and Chief Financial Officer
President and Chief Operating Officer
President and Chief Technology and Products Officer
Executive Vice President and Chief People Officer
Senior Vice President, Chief Legal Officer and Corporate Secretary
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