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Senior Physical Design Engineer

Microsoft · Posted Oct 22

Software, cloud computing, artificial intelligence, and hardware services

India, Karnataka, BangaloreFull-timeOnsiteSenior Level8+ years₹50.0L–₹80.0L yearly55 applicants
SoftwareCloud ComputingArtificial IntelligenceConsumer ElectronicsInformation TechnologyPublic Company
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About the role

Microsoft's Silicon, Cloud Hardware, and Infrastructure Engineering (SCHIE) team delivers core infrastructure and foundational technologies for Microsoft's cloud businesses, including Azure, Bing, Office 365, and Xbox Live. The semiconductor design team develops cutting-edge ASIC products. This role performs physical design implementation and integration at block, subsystem, sub-chip, and full-chip levels, covering floorplanning, synthesis, placement, CTS, routing, timing, verification, power, IR-drop, and EM.

What you will do

  • As a Physical Design Engineer, you will be responsible for Physical Design tasks at block, subsystem, sub-chip, and/or full-chip level.
  • The tasks will include Floorplanning, Synthesis, Placement, CTS and custom clocking, Routing, Static Timing, Physical Verification, Formal Equivalency, Power Efficiency, IR-Drop, and EM.
  • You may also be involved in Physical Design flow development/automation and evaluation of and recommendations for technology, IP, and vendor selection.
  • You are expected to be able to work with limited direction, have keen attention to detail, and be able to provide crisp status of progress, issues, and risks on the program to the management team. Occasional travel may be required.

Skills used in this role

Physical DesignFloorplanningSynthesisPlacementCTSCustom ClockingRoutingStatic TimingPhysical VerificationFormal EquivalencePower EfficiencyIR DropEMASICSoCTapeoutPhysical Design Flow AutomationAttention to DetailCommunication

What the employer is looking for

  • Bachelor's or master’s in electrical or computer engineering or related field with 8+ years of experience
  • Experience in physical design implementation, signoff at block / sub system / sub-chip / SoC level.
  • Experience in tapeouts of complex ASICs in leading edge technology

Benefits and support

  • Compensation and benefits are detailed in the job posting

About Microsoft

Microsoft Corporation is a multinational technology company that develops, licenses, and supports a wide range of software products, services, and hardware devices. Best known for its Windows operating systems, Microsoft 365 productivity suite, and Xbox gaming consoles, the company has expanded heavily into enterprise cloud computing via Azure and advanced artificial intelligence solutions. As one of the world's most valuable public enterprises, it empowers individuals and businesses globally through innovative digital transformation.

Industry
Software
Company size
228,000+ employees
Founded
April 4, 1975
Location
Redmond, Washington, USA
Funding stage
Public Company
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