Senior Packaging Engineer
AMD · Posted Oct 30
High-performance processors, graphics cards, data center solutions, and AI accelerators
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About the role
AMD delivers high-performance computing solutions across data center, AI, and advanced packaging technologies. The Senior Package Design Engineer will support complex package design execution, leveraging AI-driven design techniques, automation, and next-generation workflows for heterogeneous integration and advanced packaging architectures. The role involves developing substrate layouts, bump maps, and interposer designs for 2.5D/3D and chiplet-based architectures, and collaborating with SI/PI, mechanical, SOC teams, OSATs, and substrate suppliers.
What you will do
- Perform end-to-end package design execution for complex products, ensuring performance, cost, quality, and schedule targets are met
- Handle multiple concurrent design programs in a fast-paced and high-pressure environment
- Develop substrate layouts, bump maps, and interposer designs for advanced packaging (2.5D/3D, chiplet-based architectures)
- Drive design decisions through close collaboration with SI/PI, mechanical, and SOC teams
- Partner with internal engineering teams, OSATs, and substrate suppliers to deliver optimized solutions
- Interface with stakeholders to communicate design status, risks, and mitigation strategies
- Contribute to design reviews, signoff readiness, and tapeout processes
- Define and enhance package design methodologies, flows, and best practices
- Drive improvements in layout efficiency, reuse, and design standardization
Skills used in this role
What the employer is looking for
- Demonstrates strong ownership and accountability across multiple programs
- Excels in fast-phase execution environments with competing priorities
- Applies AI/ML and automation to improve design productivity and quality
- Operates with minimal supervision while influencing cross-functional teams
- Balances deep technical expertise with strong collaboration and communication skills
- Bachelor’s or higher degree in Electrical Engineering, Computer Engineering, or related field
Preferred qualifications
- Minimum 2+ years of experience in designing complex substrate design or Silicon Bridge or Interposers
- Proven ability to execute in multi-project, fast-phased, and high-pressure environments
- Strong experience in advanced packaging technologies:
- 5D / 3D integration (e.g., interposers, chiplets)
- Hands-on experience with EDA tools such as:
- Cadence SIP / APD
- Synopsys 3DICC or equivalent
- Experience working with OSATs, foundries, and substrate vendors
- Solid understanding of Signal Integrity and Power Integrity fundamentals
Benefits and support
- Compensation and benefits are detailed in the job posting
About AMD
AMD is a global semiconductor company that designs high-performance central processing units (CPUs), graphics processing units (GPUs), and adaptive processors for data centers, personal computers, gaming consoles, and embedded systems. The company specializes in advanced computing solutions and AI accelerators, positioning itself as a major leader in modern high-performance and artificial intelligence hardware. Through strategic developments and acquisitions, AMD continues to expand its ecosystem across cloud infrastructure, enterprise computing, and physical AI.
- Industry
- Semiconductors
- Company size
- 31000 employees
- Founded
- 1969-05-01
- Location
- Santa Clara, California, USA
- Funding stage
- Public Company
Funding
Public Company
- 2007-11-16Post Ipo
Leadership
Chair and Chief Executive Officer
Executive Vice President, Chief Financial Officer and Treasurer
Executive Vice President and Chief Technology Officer
Executive Vice President and Chief Commercial Officer
Executive Vice President and General Manager, Data Center Solutions Business Group
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