RF Module Design Engineer, Senior
Qualcomm · Posted Oct 26
Semiconductor, 5G wireless technology, mobile platform, and AI computing solutions
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About the role
Qualcomm is the industry leader in 3G, 4G and 5G communication technology and designs advanced radio technology for the commercial wireless marketplace, from LTE to Bluetooth. QCT's RF EM (Electromagnetic) Team focuses on the design, EM simulation, and circuit modeling of RF passive components for RFIC designs, including RF package, module, and PCB design and modeling. This role designs and develops RF passive components for next-generation highly integrated RF integrated circuits in deep sub-micron 28nm and 14ff CMOS and SOI technologies, working with the RF circuit design team on component optimization, compact models, isolation analysis, and multichip carrier optimization.
What you will do
- Design and develop RF passive components for use in the next generation of highly integrated RF integrated circuits in deep sub-micron 28nm and 14ff CMOS and SOI technologies.
- Work with the RF circuit design team to optimize component sizes and performance for use in RF circuit blocks.
- Deliver components that include compact models, and DRC clean physical designs.
- Execute isolation analysis and optimization to reduce on-chip and chip to package coupling.
- Optimization of multichip carriers for RF systems, focusing on loss and isolation.
- Participate in RF package, module, and PCB level of design and modeling to optimize overall system level performance
Skills used in this role
What the employer is looking for
- Bachelor's degree in Science, Engineering, or related field and 2+ years of ASIC design, verification, validation, integration, or related work experience.
- Master's degree in Science, Engineering, or related field and 1+ year of ASIC design, verification, validation, integration, or related work experience.
- PhD in Science, Engineering, or related field.
- Experience in the design and simulation of RF passive components such as inductors, transformers, MOM capacitors and passive filters.
- Experience in design and modeling of RF modules for RF and mmWave frequency.
- Demonstrated abilities with EM simulation techniques and tool including MoM EM solvers (EMX, PeakView, Helic) and HFSS.
- Experience with circuit design and layout using Cadence tools and Agilent ADS.
- Compact RLCK Model extraction of multiport passive components.
- Ability to use EM tools to predict circuit level electric and magnetic coupling.
- Understanding of Chip fabrication process and design understanding
- Electromagnetic theory, microwave theory and design
- Antenna design and understanding of radiation and propagation wave
- Good understanding of SI and PI at chip, package, and PCB level
- Basic RF system understanding
- Understanding of noise propagation mechanism in chip, package, and PCB
- Tools: Ansys Suit (HFSS, Q3D, SiWave, Layout), Lorentz, Helic, EMX, Cadence virtuoso, Allegro or similar for Package/Module layout, Expedition (or similar) for PCB layout and schematic
- Passionate self-starter and team player with experience in project leadership and multi-tasking.
- Educational Requirements: Required: Bachelor's degree in science, Engineering, or related field. Preferred: Master's and PhD
Benefits and support
- Compensation and benefits are detailed in the job posting
About Qualcomm
Qualcomm is a global leader in the development and commercialization of foundational technologies for the wireless industry, including mobile processors, 5G, and on-device artificial intelligence. The company designs and markets digital communications products, semiconductor solutions, and system software used globally across smartphones, automotive solutions, IoT devices, and computing systems. Through extensive R&D and intellectual property licensing, Qualcomm powers a highly interconnected and smarter world.
- Industry
- Semiconductors
- Company size
- 50000+ employees
- Founded
- 1985
- Location
- San Diego, California, USA
- Funding stage
- Public Company
Funding
Public Company · $53M raised
- 2018-11-01Grant
Leadership
President and Chief Executive Officer
Chief Financial Officer and Chief Operating Officer
James H. Thompson
Chief Technology Officer
Chief Marketing Officer
Ann Chaplin
General Counsel and Corporate Secretary
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