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Physical Design Engineer II

Microsoft · Posted Sep 30

Software, cloud computing, artificial intelligence, and hardware services

India, Karnataka, BangaloreFull-timeOnsiteSenior Level6+ years₹35.0L–₹55.0L yearly100+ applicants
SoftwareCloud ComputingArtificial IntelligenceConsumer ElectronicsInformation TechnologyPublic Company
Full time

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About the role

Microsoft Silicon, Cloud Hardware, and Infrastructure Engineering (SCHIE) builds the core infrastructure and foundational technologies powering Microsoft's Intelligent Cloud, including server and data center hardware for over 200 online businesses such as Azure, Office 365, Teams, and Xbox Live. The team defines and delivers operational measures of success for hardware manufacturing, improving planning, quality, delivery, scale and sustainability of Microsoft cloud hardware. This role is a Physical Design Engineer position focused on physical design implementation and physical integration for cutting-edge semiconductor products.

What you will do

  • As a Physical Design Engineer, you will be responsible for Physical Design tasks at block, subsystem, sub-chip, and/or full-chip level. The tasks will include Floorplanning, Synthesis, Placement, CTS and custom clocking, Routing, Static Timing, Physical Verification, Formal Equivalency, Power Efficiency, IR-Drop, and EM. You may also be involved in Physical Design flow development/automation and evaluation of and recommendations for technology, IP, and vendor selection.
  • You are expected to be able to work with limited direction, have keen attention to detail, and be able to provide crisp status of progress, issues, and risks on the program to the management team. Occasional travel may be required.

Skills used in this role

Physical DesignFloorplanningSynthesisPlacementCTSCustom ClockingRoutingStatic TimingPhysical VerificationFormal EquivalencePower EfficiencyIR DropEMASICSoCSemiconductor DesignAttention to Detail

What the employer is looking for

  • Bachelor's or master’s in electrical or computer engineering or related field with 6+ years of experience
  • Experience in physical design implementation, signoff at block / sub system / sub-chip / SoC level.
  • Experience in tapeouts of complex ASICs in leading edge technology
  • Ability to meet Microsoft, customer and/or government security screening requirements are required for this role. These requirements include but are not limited to the following specialized security screenings: Microsoft Cloud Background Check: This position will be required to pass the Microsoft Cloud Background Check upon hire/transfer and every two years thereafter.

Benefits and support

  • Compensation and benefits are detailed in the job posting

About Microsoft

Microsoft Corporation is a multinational technology company that develops, licenses, and supports a wide range of software products, services, and hardware devices. Best known for its Windows operating systems, Microsoft 365 productivity suite, and Xbox gaming consoles, the company has expanded heavily into enterprise cloud computing via Azure and advanced artificial intelligence solutions. As one of the world's most valuable public enterprises, it empowers individuals and businesses globally through innovative digital transformation.

Industry
Software
Company size
228,000+ employees
Founded
April 4, 1975
Location
Redmond, Washington, USA
Funding stage
Public Company

Leadership

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Satya Nadella

Chairman and Chief Executive Officer

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Amy Hood

Chief Financial Officer

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Brad Smith

Vice Chair and President