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Hardware Development Engineer

Nokia · Posted Oct 14

Mobile and fixed network infrastructure, IP routing, cloud, and telecommunications technology services

Bangalore, IndiaFull-timeHybridSenior Level2+ years₹18.0L–₹30.0L yearly<25 applicants
TelecommunicationsNetworkingCloud InfrastructureEnterprise SoftwareHardwarePublic Company
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About the role

Nokia's NILightpath team develops high-speed optical transceiver products, including OSFP and QSFP-DD form factors and future designs. This role focuses on structural and thermo-mechanical simulation work — finite element modeling of housings, heat sinks, optical assemblies and PCBAs — to identify structural risks, optimize designs, and validate product reliability across shock, drop, vibration and thermal cycling testing. The engineer works cross-functionally with mechanical, thermal, optics, electronics and reliability teams from concept through production release.

What you will do

  • Own structural and thermo-mechanical simulations for high-speed optical transceiver products, including OSFP, QSFP-DD, and future form factors.
  • Ensure product robustness by identifying structural risks early in the design cycle and proposing mitigation plans.
  • Work closely with cross-functional teams, including mechanical, thermal, optics, electronics, and reliability experts, to define critical parameters and drive design optimization.
  • Develop detailed finite element models of module housings, heat sinks, optical assemblies, PCBAs, and other critical components.
  • Participate in design and product gate reviews, providing structural and reliability sign-offs to ensure product quality and performance.
  • Correlate simulation results with physical testing, including mechanical shock, drop, vibration, and thermal cycling, to validate product reliability.
  • Support qualification and regulatory testing activities, performing root-cause analysis for field and validation failures.
  • Develop simulation methodologies, best practices, and design guidelines to enhance efficiency and consistency in the simulation process.
  • Evaluate new materials, manufacturing methods, and packaging technologies to stay at the forefront of industry advancements.
  • Foster a culture of innovation by developing reusable simulation templates, automation workflows, and establishing FEA processes.

Skills used in this role

FEAAbaqusANSYS WorkbenchANSYS MechanicalLS-DynaHyperMeshCreoCADGD&Tfinite element modelingstructural analysisthermo-mechanical simulationnon-linear analysisfatigue analysismodal analysismechanical shock analysisdrop simulationtolerance analysisoptical transceiversOSFPQSFP-DDoptics packagingcommunicationproblem solvinganalytical

What the employer is looking for

  • B.E./B.Tech./M.E./M.Tech. in Mechanical Engineering or equivalent, with 2+ years of experience in FEA and structural reliability engineering.
  • Strong expertise in FEA software, including Abaqus, ANSYS Workbench, ANSYS Mechanical, LS-Dyna, and HyperMesh.
  • Proficiency in linear and non-linear structural analysis, contact non-linearity, material non-linearity, geometric non-linearity, and large deformation analysis.
  • Experience with reliability simulations, including drop simulations, mechanical shock analysis, modal analysis, and fatigue assessments.
  • Knowledge of optical transceiver architecture, OSFP and QSFP-DD mechanical standards, and high-density packaging constraints.
  • Working knowledge of Creo or equivalent CAD tools, with experience in GD&T interpretation, tolerance analysis, and component design.
  • Understanding of manufacturing and assembly processes, and experience with optical modules, optics packaging, or compact electronics products is preferred.
  • Excellent communication and technical presentation skills, with the ability to collaborate effectively in a cross-functional environment.
  • Proven track record of delivering products from concept to production release, demonstrating strong analytical and problem-solving abilities.
  • Passion for continuous learning and staying updated with industry trends and advancements in FEA and structural reliability engineering.

Benefits and support

  • Compensation and benefits are detailed in the job posting

About Nokia

Nokia Corporation is a multinational telecommunications, information technology, and network equipment provider that delivers critical infrastructure solutions across mobile, fixed, and cloud networks. Known for its historical roots and ongoing global presence in connectivity, the company enables advanced network automation, AI-optimized data center infrastructure, and 5G/6G technology for communications service providers and enterprises worldwide.

Industry
Telecommunications
Company size
78005 employees
Founded
1865-05-12
Location
Espoo, Finland
Funding stage
Public Company

Leadership

JH
Justin Hotard

President and Chief Executive Officer (CEO)

MW
Marco Wirén

Chief Financial Officer

PM
Pallavi Mahajan

Chief Technology and AI Officer

DH
David Heard

President of Network Infrastructure