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Hardware Development Engineer

Nokia · Posted Oct 15

Mobile and fixed network infrastructure, IP routing, cloud, and telecommunications technology services

Bangalore, IndiaFull-timeHybridMid Level3+ years₹16.0L–₹26.0L yearly<25 applicants
TelecommunicationsNetworkingCloud InfrastructureEnterprise SoftwareHardwarePublic Company
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About the role

The role sits within Nokia's NI ON PSE HW&TE GX Syst HW & CentEng 5 department, working on NILightpath optical networking hardware. The team develops high-speed pluggable optical transceivers and compact networking products spanning 25G to 1.6T applications. This engineer owns thermal design, simulation, and optimization for form factors such as OSFP, OSFP-XD, QSFP-DD, QSFP112, QSFP56, and CFP, driving thermal architecture decisions across the product development lifecycle.

What you will do

  • Own thermal design, simulation, and optimization for OSFP, OSFP-XD, QSFP-DD, QSFP112, QSFP56, CFP, and future form factors.
  • Develop thermal solutions for modules supporting 25G to 1.6T applications, ensuring compliance with specifications.
  • Collaborate with mechanical, signal integrity, optics, electronics, manufacturing, and reliability teams.
  • Select and optimize thermal solutions such as heat spreaders, sinks, vapor chambers, and heat pipes.
  • Understand and manage module-to-cage thermal interfaces and host-system cooling interactions.
  • Perform thermal simulations using FloTHERM and other thermal analysis tools and optimize airflow paths, pressure drops, and component temperatures.
  • Correlate simulation results with lab measurements and drive design improvements.
  • Conduct thermal validation and testing, including thermal characterization, airflow analysis, and power dissipation testing.

Skills used in this role

FloTHERMthermal simulationthermal designelectronics coolingOSFPOSFP-XDQSFP-DDQSFP112QSFP56CFPSFPheat spreadersheat sinksvapor chambersheat pipesairflow analysisDSPASICoptical modulesIR imagingthermocouplesthermal validationsignal integrityopticsanalytical skillstechnical reporting

What the employer is looking for

  • B.E./B.Tech/M.E./M.Tech in Mechanical, Thermal, Aerospace Engineering, or related field.
  • 3+ years of electronics cooling and thermal engineering experience.
  • 2+ years of thermal design for pluggable optical modules (OSFP, QSFP-DD, CFP, SFP family).
  • Strong understanding of thermal challenges in DSP/ASIC cooling, optical engines, and laser devices.
  • Experience with FloTHERM and other thermal tools for thermal simulations and modeling.
  • Ability to correlate simulation results with lab measurements and drive design improvements.
  • Hands-on experience with thermal validation for optical transceivers or compact networking products.
  • Proficiency in thermal validation tools and techniques, including thermocouples and IR imaging.
  • Strong analytical skills, methodical approach, and excellent technical reporting abilities.

Benefits and support

  • Compensation and benefits are detailed in the job posting

About Nokia

Nokia Corporation is a multinational telecommunications, information technology, and network equipment provider that delivers critical infrastructure solutions across mobile, fixed, and cloud networks. Known for its historical roots and ongoing global presence in connectivity, the company enables advanced network automation, AI-optimized data center infrastructure, and 5G/6G technology for communications service providers and enterprises worldwide.

Industry
Telecommunications
Company size
78005 employees
Founded
1865-05-12
Location
Espoo, Finland
Funding stage
Public Company

Leadership

JH
Justin Hotard

President and Chief Executive Officer (CEO)

MW
Marco Wirén

Chief Financial Officer

PM
Pallavi Mahajan

Chief Technology and AI Officer

DH
David Heard

President of Network Infrastructure