Electrical CM Support Engineer - Operations Engineering Team
Nokia · Posted Oct 15
Mobile and fixed network infrastructure, IP routing, cloud, and telecommunications technology services
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About the role
The Engineering Operations Team develops, qualifies, and sustains advanced assembly and interconnect processes for high-performance electronic products, working across the full lifecycle from New Product Introduction through volume manufacturing. The role covers complex assembly technologies such as SMT, fine-pitch PCBA, organic and mSAP-based substrates, reflow, hot bar and laser soldering, flip-chip assembly, and advanced packaging, supported by inspection and analytical techniques including X-ray, cross-sectioning, microscopy, and reliability testing. The Electrical CM Support Engineer drives process optimization, yield improvement, and root cause analysis while collaborating with design, supplier, and factory teams.
What you will do
- Develop, optimize, and qualify SMT, through-hole, laser soldering, hot bar soldering, flip-chip, underfill, die attach, and advanced packaging processes.
- Define and maintain robust process windows for reflow soldering and advanced electronic assembly technologies.
- Support New Product Introduction (NPI) from prototype builds through high-volume manufacturing.
- Conduct process characterization, Design of Experiments (DOE), and process capability studies.
- Lead failure analysis and root-cause investigations using X-ray, cross-sectioning, microscopy, and electrical characterization.
- Perform cross-sectional analysis to assess solder joint integrity, PCB structures, and manufacturing defects.
- Drive yield improvement, quality enhancement, process optimization, and cost reduction initiatives.
- Collaborate with design teams to ensure Design for Manufacturing (DFM), Design for Assembly (DFA), and Design for Reliability (DFR).
- Develop manufacturing specifications, work instructions, control plans, process documentation, and qualification reports.
- Work closely with suppliers, contract manufacturers, and factory teams for reliability testing and production readiness.
Skills used in this role
What the employer is looking for
- BS/MS/PhD in Electrical, Electronics, Manufacturing Engineering, Materials Science, or related field
- Strong expertise in electronics manufacturing, SMT assembly, reflow soldering, thermal profiling, and advanced PCB technologies.
- Hands-on experience with advanced interconnect and packaging technologies (laser soldering, flip-chip, underfill, die attach).
- Proven capability in X-ray inspection, cross-section analysis, solder joint characterization, and failure/root-cause investigations.
- Experience with semiconductor packaging, silicon photonics, RF/optical modules, advanced failure analysis techniques (e.g., SEM, EDS, FIB), and familiarity with Industry 4.0/automation.
Benefits and support
- Compensation and benefits are detailed in the job posting
About Nokia
Nokia Corporation is a multinational telecommunications, information technology, and network equipment provider that delivers critical infrastructure solutions across mobile, fixed, and cloud networks. Known for its historical roots and ongoing global presence in connectivity, the company enables advanced network automation, AI-optimized data center infrastructure, and 5G/6G technology for communications service providers and enterprises worldwide.
- Industry
- Telecommunications
- Company size
- 78005 employees
- Founded
- 1865-05-12
- Location
- Espoo, Finland
- Funding stage
- Public Company
Leadership
President and Chief Executive Officer (CEO)
Chief Financial Officer
Chief Technology and AI Officer
President of Network Infrastructure
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