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CPU Physical Design Engineer (Lead/Staff/Sr. Staff)

Qualcomm · Posted Oct 28

Semiconductor, 5G wireless technology, mobile platform, and AI computing solutions

Bangalore, IndiaFull-timeOnsiteLead/Staff5+ years₹35.0L–₹60.0L yearly64 applicants
SemiconductorsWireless TechnologyTelecommunicationsArtificial IntelligenceMobile ComputingPublic Company
Full time

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About the role

Qualcomm's Hardware Engineering Group develops electronic systems, circuits, packaging and test systems that power next-generation products. The role sits in CPU physical design, focused on high-speed core implementation from RTL to GDSII with PPA, power delivery network and timing signoff targets. The engineer will lead block-level or chip-level physical design, STA and PDN activities and handle technical deliveries with a small team.

What you will do

  • As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products.
  • Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements.

Skills used in this role

What the employer is looking for

  • Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 6+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 5+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience.
  • Masters/Bachelors Degree in Electrical/Electronics science engineering with at least 5 years of experience in physical design.
  • Experience in Physical Design and timing signoff for high speed cores.
  • Should have good exposure to high frequency design convergence for physical design with PPA targets and PDN methodology.
  • Experience in leading block level or chip level Physical Design, STA and PDN activities.
  • Work independently in the areas of RTL to GDSII implementation.
  • Ability to collaborate and resolve issues wrt constraints validation, verification, STA, Physical design, etc.
  • Knowledge of low power flow (power gating, multi-Vt flow, power supply management etc.)
  • Circuit level comprehension of time critical paths in the design Understanding of deep sub-micron design problems and solutions (leakage power, signal integrity, DFM etc.)
  • Tcl/Perl scripting Willing to handle technical deliveries with a small team of engineers.
  • Strong problem-solving skills.

Benefits and support

  • Compensation and benefits are detailed in the job posting

About Qualcomm

Qualcomm is a global leader in the development and commercialization of foundational technologies for the wireless industry, including mobile processors, 5G, and on-device artificial intelligence. The company designs and markets digital communications products, semiconductor solutions, and system software used globally across smartphones, automotive solutions, IoT devices, and computing systems. Through extensive R&D and intellectual property licensing, Qualcomm powers a highly interconnected and smarter world.

Industry
Semiconductors
Company size
50000+ employees
Founded
1985
Location
San Diego, California, USA
Funding stage
Public Company

Funding

Public Company · $53M raised

Western Technology Investment
  • 2018-11-01Grant

Leadership

CR
Cristiano R. Amon

President and Chief Executive Officer

AP
Akash Palkhiwala

Chief Financial Officer and Chief Operating Officer

JH

James H. Thompson

Chief Technology Officer

DM
Don McGuire

Chief Marketing Officer

AC

Ann Chaplin

General Counsel and Corporate Secretary

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