
CPU Physical Design Engineer (Lead/Staff/Sr. Staff)
Qualcomm · Posted Oct 28
Semiconductor, 5G wireless technology, mobile platform, and AI computing solutions
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About the role
Qualcomm's Hardware Engineering Group develops electronic systems, circuits, packaging and test systems that power next-generation products. The role sits in CPU physical design, focused on high-speed core implementation from RTL to GDSII with PPA, power delivery network and timing signoff targets. The engineer will lead block-level or chip-level physical design, STA and PDN activities and handle technical deliveries with a small team.
What you will do
- As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products.
- Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements.
Skills used in this role
What the employer is looking for
- Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 6+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 5+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience.
- Masters/Bachelors Degree in Electrical/Electronics science engineering with at least 5 years of experience in physical design.
- Experience in Physical Design and timing signoff for high speed cores.
- Should have good exposure to high frequency design convergence for physical design with PPA targets and PDN methodology.
- Experience in leading block level or chip level Physical Design, STA and PDN activities.
- Work independently in the areas of RTL to GDSII implementation.
- Ability to collaborate and resolve issues wrt constraints validation, verification, STA, Physical design, etc.
- Knowledge of low power flow (power gating, multi-Vt flow, power supply management etc.)
- Circuit level comprehension of time critical paths in the design Understanding of deep sub-micron design problems and solutions (leakage power, signal integrity, DFM etc.)
- Tcl/Perl scripting Willing to handle technical deliveries with a small team of engineers.
- Strong problem-solving skills.
Benefits and support
- Compensation and benefits are detailed in the job posting
About Qualcomm
Qualcomm is a global leader in the development and commercialization of foundational technologies for the wireless industry, including mobile processors, 5G, and on-device artificial intelligence. The company designs and markets digital communications products, semiconductor solutions, and system software used globally across smartphones, automotive solutions, IoT devices, and computing systems. Through extensive R&D and intellectual property licensing, Qualcomm powers a highly interconnected and smarter world.
- Industry
- Semiconductors
- Company size
- 50000+ employees
- Founded
- 1985
- Location
- San Diego, California, USA
- Funding stage
- Public Company
Funding
Public Company · $53M raised
- 2018-11-01Grant
Leadership
President and Chief Executive Officer
Chief Financial Officer and Chief Operating Officer
James H. Thompson
Chief Technology Officer
Chief Marketing Officer
Ann Chaplin
General Counsel and Corporate Secretary
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