
Lead I/O Design Engineer
NXP Semiconductors · Posted Oct 15
High-performance mixed-signal and standard semiconductor products for automotive, industrial, and mobile applications
Get a personal compatibility score
Add a resume for personal matches
About the role
NXP's India organization develops next-generation semiconductor products, with the I/O design team responsible for custom input/output circuits in advanced CMOS technology nodes. The team works across GPIO, LVDS, LVCMOS, SSTL/HSTL, DDR interfaces and high-speed SerDes support circuits, along with ESD protection and signal integrity. This lead role owns transistor-level IO circuit design and simulation, layout review, signal integrity analysis, and silicon bring-up, characterization and production ramp.
What you will do
- Design and develop custom IO circuits including: GPIO, LVDS, LVCMOS, SSTL, HSTL, DDR Interfaces, High-speed SerDes support circuits
- Perform transistor-level design and simulation using advanced CMOS technology nodes.
- Develop and optimize: ESD protection circuits, Level shifters, Input buffers, Output drivers, On-chip termination circuits
- Conduct pre-layout and post-layout simulations for functionality, timing, power, noise, and reliability.
- Perform signal integrity analysis including: IBIS model generation, Package-aware simulations, Crosstalk and reflection analysis
- Drive layout reviews and work closely with physical design teams to ensure design quality and performance targets.
- Support silicon bring-up, characterization, debugging, and production ramp activities.
- Collaborate with system, package, reliability, and product engineering teams.
- Develop and maintain design documentation, specifications, and verification reports.
Skills used in this role
What the employer is looking for
- Bachelor's or Master's degree in Electronics Engineering, Electrical Engineering, Microelectronics, or related field.
- 5-8 years of experience in Analog/Mixed-Signal or IO Circuit Design.
- Strong understanding of: CMOS device physics, Analog circuit design fundamentals, IO architectures and standards, ESD design methodologies
- Hands-on experience in custom circuit design using Cadence Virtuoso.
- Expertise in SPICE-based simulators such as Spectre, HSPICE, or FineSim.
- Experience with advanced technology nodes (16nm/7nm/5nm preferred).
- Good knowledge of LVS, DRC, EMIR, and reliability checks.
- Familiarity with process corners, Monte Carlo analysis, and yield optimization techniques.
- Strong analytical and debugging skills.
- Excellent communication and cross-functional collaboration.
- Ability to lead technical discussions and mentor junior engineers.
- Proven track record of delivering silicon successfully from specification to production.
- Self-driven with strong problem-solving abilities.
Preferred qualifications
- Experience with DDR4/DDR5, LPDDR, USB, PCIe, MIPI, or Ethernet interfaces.
- Knowledge of package modeling and SI/PI analysis tools.
- Understanding of ESD standards such as HBM, CDM, and IEC.
- Experience in silicon validation and lab characterization.
- Scripting skills in Python, Perl, Tcl, or SKILL.
- Familiarity with IBIS and IBIS-AMI model generation.
- Experience in automotive, AI/ML, networking, mobile, or data center SoCs.
- Exposure to functional safety and reliability requirements.
- Prior ownership of complete IO IP development cycle.
Benefits and support
- Compensation and benefits are detailed in the job posting
About NXP Semiconductors
NXP Semiconductors enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better, and safer. As a global semiconductor leader, the company drives innovation in automotive processing, secure connected edge systems, industrial IoT, and mobile communications infrastructure.
- Industry
- Semiconductors
- Company size
- 32169 employees
- Founded
- 2006
- Location
- Eindhoven, Netherlands
- Funding stage
- Public Company
Funding
Public Company
Leadership
Rafael Sotomayor
President and Chief Executive Officer
Bill Betz
Executive Vice President and Chief Financial Officer
Lars Reger
Executive Vice President and Chief Technology Officer
Chris Jensen
Executive Vice President and Chief People Officer
Jennifer Wuamett
Executive Vice President, General Counsel, and Chief Sustainability Officer
Recent coverage
European Investment Bank
European chipmaker NXP receives $250 million in financing from EIB Global to boost operations in Malaysia2026-10-13
NXP Semiconductors
NXP Semiconductors Announces Conference Call to Review Third Quarter 2026 Financial Results2026-10-06
NXP Semiconductors
VSMC Celebrates the Grand Opening of Its First 300mm Fab in Singapore2026-09-28
NXP Semiconductors
NXP Semiconductors Breaks Ground on Assembly and Test Site Expansion in Malaysia2026-08-12