
NFC FW Architect
NXP Semiconductors · Posted Oct 21
High-performance mixed-signal and standard semiconductor products for automotive, industrial, and mobile applications
Get a personal compatibility score
Add a resume for personal matches
About the role
The NFC Firmware organization at NXP builds firmware for NFC-based platforms used across mobile, wearables, automotive, and IoT, spanning secure NFC transactions, digital wallets, infrastructure services, platform enablement, and low-level silicon integration. The role is a hands-on firmware architect position focused on platform firmware architecture and execution for PCRM, low-level platform software, tapeout readiness, and post-silicon bring-up. The architect will define firmware architectures close to silicon and collaborate with hardware, systems, validation, and firmware development teams.
What you will do
- She/He shall work as an NFC Firmware Architect and contribute to new product development, debugging, bring-up, and maintenance of NXP's embedded firmware for NFC products.
- Define and support firmware architecture for RISC-V/ARM platform.
- Derive firmware requirements from system, hardware, PCRM, and customer specifications.
- Design firmware sub-systems and low-level software components to meet functional, performance, memory, timing, and power requirements.
- Review design and code contributions, provide technical guidance, and help maintain quality of firmware deliverables.
- Own one or more firmware modules or platform software sub-systems from design through integration and bring-up.
- Define and write firmware design specifications, interface specifications, and low-level platform software documentation.
- Support definition of validation and bring-up environments for pre-silicon, emulation, FPGA, and post-silicon phases.
- Contribute to firmware test strategy at unit, integration, system, and silicon bring-up levels.
- Support tapeout readiness activities by reviewing firmware dependencies, register/interface assumptions, boot flows, and hardware-software integration risks.
- Closely interact with hardware development teams, system architects, validation teams, and component technical experts to resolve low-level integration issues.
- Collaborate effectively with partner teams and ensure firmware architecture considers product, platform, and silicon constraints.
- Define firmware design guidelines, development flows, debug approaches, and bring-up checklists for platform software.
Skills used in this role
What the employer is looking for
- 8-12 years of embedded firmware development experience, preferably in SoC, mobile, secure embedded, or RTOS-based embedded systems.
- Bachelor’s or Master’s Degree in Electronics & Communication, Power Electronics from reputed institute with strong academic records.
- Embedded software design and development on 8/16/32-bit platforms, preferably RISC-V and ARM architectures.
- Excellent C programming skills, exposure to assembly with hands-on development experience.
- Must have experience in low-level firmware programming, including boot flows, boot loaders, interrupt handling, memory maps, clocks, power states, SPI/I2C/UART drivers, RF interfaces, and embedded RTOS concepts.
- Hands-on knowledge of RTOS, its concepts and usage.
- Good knowledge of SoC hardware IP datasheets, register-level programming, hardware-software interfaces, and low-level driver development.
- Hands-on exposure to PCRM topics, platform configuration, reset/clock/power management, and low-level initialization flows.
- Experience supporting tapeout and bring-up activities, including pre-silicon validation on RTL, FPGA/emulation usage, post-silicon debug, and issue triage with hardware teams.
- Exposure to IDEs like LPCXpresso, Keil, Eclipse
- Experience in using Debuggers. (TRAC32/J-LINK/LPC-LINK)
- Exposure to change management / configuration management, bug tracking tools.
- Hands-on with AI based efficiency gaining tools.
- Excellent analytical, problem solving, debugging skills & influencing skills with go-to attitude
- Self-motivated, proactive, good verbal and written communication.
- Sufficiently mobile and flexible, work location based out of Bangalore
- Experienced in requirements derivation, low-level design, high-level design, and hands-on implementation in platform firmware domains.
- Empathic communicator, able to see things from the other person's point of view and a good team player with cross functional, cross cultural & Global teams
Preferred qualifications
- Exposure to C++ / C#, Perl/Python is an added advantage
- Good understanding of NFC technology.
- Knowledge of software development life cycle (SDLC) for embedded firmware development
- Knowledge of embedded platforms, low-level platform software, and close collaboration with hardware teams is preferred.
- Understanding of tapeout milestones, silicon bring-up planning, debug instrumentation, and hardware-software readiness criteria.
- Know-how of smart card Contact less Proximity Standards such as ISO14443, ISO15693, ISO18092, ISO7816 etc.
- Near Field Communication Standards.
- Willing to travel to other countries on need basis
Benefits and support
- Compensation and benefits are detailed in the job posting
About NXP Semiconductors
NXP Semiconductors enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better, and safer. As a global semiconductor leader, the company drives innovation in automotive processing, secure connected edge systems, industrial IoT, and mobile communications infrastructure.
- Industry
- Semiconductors
- Company size
- 32169 employees
- Founded
- 2006
- Location
- Eindhoven, Netherlands
- Funding stage
- Public Company
Funding
Public Company
Leadership
Rafael Sotomayor
President and Chief Executive Officer
Bill Betz
Executive Vice President and Chief Financial Officer
Lars Reger
Executive Vice President and Chief Technology Officer
Chris Jensen
Executive Vice President and Chief People Officer
Jennifer Wuamett
Executive Vice President, General Counsel, and Chief Sustainability Officer
Recent coverage
NXP Newsroom
VSMC Celebrates the Grand Opening of Its First 300mm Fab in SingaporeSeptember 28, 2026
NXP Newsroom
NXP Semiconductors Breaks Ground on Assembly and Test Site Expansion in MalaysiaAugust 12, 2026
NXP Newsroom
NXP Trimension Ultra-Wideband Powers BMW Group's Digital Key Plus and Presence DetectionAugust 04, 2026
NXP Newsroom
NXP Semiconductors Reports Second Quarter 2026 ResultsJuly 28, 2026