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Senior Package Layout Engineer - Hardware

NVIDIA · Posted Oct 16

Graphics processing units, artificial intelligence platforms, accelerated computing, and data center solutions

India, BengaluruFull-timeHybridSenior Level5+ years₹28.0L–₹45.0L yearly<25 applicants
SemiconductorsArtificial IntelligenceComputer HardwareCloud ComputingPublic Company
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About the role

NVIDIA's GPUs and SOCs lead the industry in power, performance and efficiency, and the company continually innovates to solve hard problems across a wide range of sectors. This position sits within the Layout team, which implements high speed/density ASIC packages and IC substrate layouts for NVIDIA products. The Senior Package Layout Engineer will collaborate with the Technical Package Lead and design teams on substrate breakout, package pinout optimization, routing, placement, stack-up and power distribution, while planning schedules and resolving cost, manufacturing and electrical design issues.

What you will do

  • As part of a Layout team, you will collaborate to implement high speed/density ASIC packages.
  • Perform substrate breakout patterns for ASIC packages.
  • Optimize package pinout incorporating system level trade-offs of pins assignment.
  • Help perform package routing, placement, stack-up, reference plane and power distribution using Cadence APD or SiP tool suite.
  • Propose layout design trade-offs to the Technical Package Lead for resolution and implementation.
  • Conduct design feasibility studies to evaluate the Package design goals for size, cost, and system performance.
  • Develop symbols and CAD library databases using Cadence APD design tools
  • Develop methodologies to improve layout productivity

Skills used in this role

Cadence APDSiPPCB LayoutConstraint ManagerVirtuosoCalibreValorSignal IntegrityHDIWire BondFlip ChipASICCAD

What the employer is looking for

  • Hold a B.S. Electrical Engineering or equivalent experience
  • 5+ years experience in PCB Layout of graphics cards, motherboards, line cards or other related technology. Experience with HDI designs is a plus
  • Proven experience in substrate layout of wire bond and flip chip packages, preferred
  • Significant background with Cadence APD or SiP and/or PCB layout tools (including Constraint Manager)
  • Solid understanding of high-speed design signal integrity practices
  • Experience with Virtuoso and Calibre is a plus
  • Experience using Valor is helpful

Benefits and support

  • Compensation and benefits are detailed in the job posting

About NVIDIA

NVIDIA Corporation is a multinational technology company that designs graphics processing units (GPUs) for the gaming and professional markets, as well as system on a chip units (SoCs) for the mobile computing and automotive market. Pioneering accelerated computing, the company has become a driving engine of modern artificial intelligence, deep learning, and data center infrastructure.

Industry
Semiconductors
Company size
42000+ employees
Founded
April 5, 1993
Location
Santa Clara, California, USA
Funding stage
Public Company

Funding

Public Company · $5M raised

Worldview Technology Partners

Leadership

JH
Jensen Huang

Founder, President and Chief Executive Officer

CK
Colette Kress

Executive Vice President and Chief Financial Officer

CA
Chris A. Malachowsky

Founder and NVIDIA Fellow

JP
Jay Puri

Executive Vice President, Worldwide Field Operations

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