Silicon Package Design Engineer
Intel · Posted Nov 2
Semiconductor manufacturing, microprocessors, data center solutions, and artificial intelligence infrastructure
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About the role
The Assembly and Test Technology Development (ATTD) Design group at Intel advances the company's semiconductor packaging technologies, focusing on optimizing silicon-package-board performance and driving innovations in substrate design. The role involves end-to-end development of cutting-edge substrate designs, performing substrate fit and routing studies to optimize performance, cost, and manufacturability while collaborating with customers and internal teams. The engineer will create physical layouts, bump patterns, routing and power grids, and run layout verification to ensure electrical and manufacturing requirements are met.
What you will do
- Develop physical layout designs for silicon packages, assembly test chips, and Intel's EMIB (Embedded Multi-die Interconnect Bridge) technologies.
- Collaborate with customers and electrical engineers to optimize signal integrity and power delivery.
- Create bump patterns and placements while adhering to design rule requirements.
- Perform signal routing planning and power grid placement to meet electrical and manufacturing standards.
- Conduct various layout verification processes, including routing checks, connectivity validation, DRC (Design Rule Check), and electromigration analysis.
- Provide feedback on feasibility studies and implement customer enhancement requests.
- Resolve design and methodology challenges related to layout design tools and workflows.
- Document design processes and maintain collateral in product lifecycle management systems.
Skills used in this role
What the employer is looking for
- Bachelor's degree in Electrical Engineering, Electronics Engineering, Computer Engineering, or a STEM-related field with 1-6 years of hands-on experience in silicon packaging design, demonstrated through academic projects, internships, coursework, or training OR a Master's degree in a related field with no prior professional experience.
- Proficiency in EDA tools such as Cadence or Siemens for package/PCB design.
- Familiarity with programming languages such as Python, Perl, Linux, and/or SKILL.
- Strong understanding of electrical field theories and electronic fundamentals.
Preferred qualifications
- Excellent written and verbal communication skills.
- Attention to detail and a customer-oriented mindset.
- Highly motivated and results-driven with a passion for innovation.
Benefits and support
- Compensation and benefits are detailed in the job posting
About Intel
Intel Corporation is a global technology leader focused on the design and manufacturing of microprocessors, integrated circuits, and advanced data center infrastructure. The company drives innovation across personal computing, artificial intelligence, and cloud ecosystems while operating a major semiconductor foundry business. Intel delivers foundational silicon and packaging solutions that power modern digital infrastructure worldwide.
- Industry
- Semiconductors
- Company size
- 10001+ employees
- Founded
- 1968
- Location
- Santa Clara, California, USA
- Funding stage
- Public Company
Leadership
Lip-Bu Tan
Chief Executive Officer
Executive Vice President and Chief Financial Officer
Pushkar Ranade
Chief Technology Officer and Chief of Staff to the CEO
Executive Vice President – Chief Technology and Operations Officer, General Manager Intel Foundry
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