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Senior CAD Engineer – Physical Design Signoff

Intel · Posted Oct 15

Semiconductor manufacturing, microprocessors, data center solutions, and artificial intelligence infrastructure

India, BangaloreFull-timeHybridSenior Level8+ years₹40.0L–₹60.0L yearly<25 applicants
SemiconductorsHardwareArtificial IntelligenceCloud ComputingFoundry ServicesPublic Company
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About the role

Intel is looking for a Senior Physical Design Signoff Automation Engineer to develop and deploy signoff methodologies and automation solutions for advanced CPU and SoC designs. The role works closely with Physical Design, Timing, Power, Reliability, and CAD teams across parasitic extraction, STA, ERC, power integrity, and signal integrity signoff. The engineer will build scalable automation frameworks, scripts, dashboards, and reporting to improve signoff quality, productivity, and turnaround time.

What you will do

  • Develop and enhance automation solutions for Physical Design signoff flows, including: RC Extraction, Static Timing Analysis (STA), Electrical Rule Checking (ERC), Power Integrity (IR Drop/EM), Signal Integrity (SI)
  • Create scalable automation frameworks to reduce signoff turnaround time and improve engineering productivity.
  • Develop scripts and tools to automate signoff checks, debugging, reporting, and data analysis.
  • Analyze and resolve timing, extraction, ERC, and power signoff issues in collaboration with design teams.
  • Drive methodology improvements to improve signoff convergence, quality, and correlation across implementation stages.
  • Partner with EDA vendors and internal CAD teams to evaluate and deploy new signoff capabilities.
  • Build dashboards and reporting infrastructure to monitor signoff health and project readiness.

Skills used in this role

PythonTclShell scriptingRC ExtractionParasitic ExtractionStatic Timing AnalysisElectrical Rule CheckingPower IntegrityIR DropEM analysisSignal IntegrityEDAAOCV/POCVmachine learningAgentic AIdistributed computing

What the employer is looking for

  • M.Tech/M.S. in Electrical Engineering, VLSI, Computer Engineering, or related field.
  • 8+ years of industry experience in Physical Design, Signoff, CAD, or Design Automation.
  • Strong proficiency in: Python, Tcl, Shell scripting

Preferred qualifications

  • Experience working on advanced process technologies (3nm, 2nm, Intel 18A/14A, or equivalent).
  • Understanding of AOCV/POCV and variation-aware timing methodologies.
  • Familiarity with power delivery networks, EM analysis, and reliability signoff.
  • Experience in Machine-learning methods and Agentic AI systems to solve CAD problems
  • Exposure to CPU core, high-performance compute, or large SoC designs.
  • Experience with distributed computing environments and large-scale signoff infrastructure.

Benefits and support

  • Compensation and benefits are detailed in the job posting

About Intel

Intel Corporation is a global technology leader focused on the design and manufacturing of microprocessors, integrated circuits, and advanced data center infrastructure. The company drives innovation across personal computing, artificial intelligence, and cloud ecosystems while operating a major semiconductor foundry business. Intel delivers foundational silicon and packaging solutions that power modern digital infrastructure worldwide.

Industry
Semiconductors
Company size
10001+ employees
Founded
1968
Location
Santa Clara, California, USA
Funding stage
Public Company

Leadership

LT

Lip-Bu Tan

Chief Executive Officer

DZ
David Zinsner

Executive Vice President and Chief Financial Officer

PR

Pushkar Ranade

Chief Technology Officer and Chief of Staff to the CEO

NC
Naga Chandrasekaran

Executive Vice President – Chief Technology and Operations Officer, General Manager Intel Foundry