Silicon Packaging Design Engineer
Intel · Posted Oct 7
Semiconductor manufacturing, microprocessors, data center solutions, and artificial intelligence infrastructure
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About the role
The Data Center Group at Intel develops cutting-edge silicon packaging solutions that drive the company's innovation and technological leadership. The team works on substrate design and package development for next-generation semiconductor products, from concept through tapeout. This role covers substrate design development, physical layout and routing, design rule definition, and cross-functional collaboration to optimize silicon-package-board performance and manufacturability.
What you will do
- Drive the complete development of substrate designs, starting from initial concept through tapeout.
- Perform physical layout and routing of package designs, ensuring adherence to design requirements.
- Conduct substrate fit and routing studies to establish optimal tradeoffs between design, performance, and cost.
- Collaborate with silicon and hardware teams to optimize silicon-package-board performance and pinout configurations.
- Define and implement substrate design rules to meet product and manufacturing requirements.
- Perform internal and external design reviews, analyze data, and resolve design rule violations (DRCs).
- Integrate design documentation and collateral into the product lifecycle management system.
- Continuously seek opportunities to improve package design for manufacturability (DFM) and quality assurance.
Skills used in this role
What the employer is looking for
- Diploma in Electronic/ Electrical Engineering or a related field.
- six months or more years of work experience in Semiconductor field related to design of silicon packaging or PCB.
- Novice to intermediate proficiency in substrate design and development, including physical layout and routing.
- Basic understanding of I/O fundamentals, package interconnect, and power delivery principles.
- Familiarity with design for manufacturability (DFM) and quality assurance processes.
- Strong problem-solving skills with a disciplined approach to execution.
Preferred qualifications
- Preferred experience into E-CAD tool.
- Effective communication skills to convey technical information and collaborate with cross-functional teams.
- A proactive mindset to identify design improvement opportunities and ensure alignment with project goals.
- Passion for driving innovation and contributing to complex engineering challenges.
Benefits and support
- Compensation and benefits are detailed in the job posting
About Intel
Intel Corporation is a global technology leader focused on the design and manufacturing of microprocessors, integrated circuits, and advanced data center infrastructure. The company drives innovation across personal computing, artificial intelligence, and cloud ecosystems while operating a major semiconductor foundry business. Intel delivers foundational silicon and packaging solutions that power modern digital infrastructure worldwide.
- Industry
- Semiconductors
- Company size
- 10001+ employees
- Founded
- 1968
- Location
- Santa Clara, California, USA
- Funding stage
- Public Company
Leadership
Lip-Bu Tan
Chief Executive Officer
Executive Vice President and Chief Financial Officer
Pushkar Ranade
Chief Technology Officer and Chief of Staff to the CEO
Executive Vice President – Chief Technology and Operations Officer, General Manager Intel Foundry
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